Intel Asia-Pacific R&D Ltd. PCCG Group is finding a graphics SW application in
tern.
Job Description
In this position, you will be responsible working with team members on Intel g
raphics driver/video BIOS. Your responsibilities will include, but not be limi
ted to:
- Be a Applications Intern to support Intels Mobile Processors and Platforms.
- Participate in all phases of product development from definition through vol
ume production.
- Customer issue clarification, duplication, debug, provide critical customer
technical support.
- Prepare key technical collateral including Data Sheets, Specification Update
, Application Notes, and other collaterals/documentation necessary to close de
sign wins and launch products.
Qualifications
You should be the second-year master in Computer Science or Electronic Enginee
ring & should be available to work at least 3-4 days a week.
- Strong C/C and x86 Assembler experience is desirable.
- Specific knowledge about processors/chipsets/ integrated graphics architectu
res, knowledge of BIOS/OS is desirable.
- Display drivers, BIOS, Open GL, DirectX Media knowledge/ working experience,
or Direct3D equivalent Knowledge is preferred.
- Fluency in English and Excellent Writing capability is required.
- Willingness to learn and gain new knowledge.
- Experience with Intel processors, PCIx, AGP and platform/component level deb
ug is preferred.
Duration
One year or longer. At least 3-4 days per week
If you are interested in this position and consider yourself a qualified candi
date, please send your resume to xudong.hua@intel.com
tern.
Job Description
In this position, you will be responsible working with team members on Intel g
raphics driver/video BIOS. Your responsibilities will include, but not be limi
ted to:
- Be a Applications Intern to support Intels Mobile Processors and Platforms.
- Participate in all phases of product development from definition through vol
ume production.
- Customer issue clarification, duplication, debug, provide critical customer
technical support.
- Prepare key technical collateral including Data Sheets, Specification Update
, Application Notes, and other collaterals/documentation necessary to close de
sign wins and launch products.
Qualifications
You should be the second-year master in Computer Science or Electronic Enginee
ring & should be available to work at least 3-4 days a week.
- Strong C/C and x86 Assembler experience is desirable.
- Specific knowledge about processors/chipsets/ integrated graphics architectu
res, knowledge of BIOS/OS is desirable.
- Display drivers, BIOS, Open GL, DirectX Media knowledge/ working experience,
or Direct3D equivalent Knowledge is preferred.
- Fluency in English and Excellent Writing capability is required.
- Willingness to learn and gain new knowledge.
- Experience with Intel processors, PCIx, AGP and platform/component level deb
ug is preferred.
Duration
One year or longer. At least 3-4 days per week
If you are interested in this position and consider yourself a qualified candi
date, please send your resume to xudong.hua@intel.com