機械英語詞匯翻譯-形狀與尺寸

線(通道)：conduction (track)
    導線(體)寬度：conductor width
    導線距離：conductor spacing
    導線層：conductor layer
    導線寬度/間距：conductor line/space
    第一導線層：conductor layer No.1
    圓形盤：round pad
    方形盤：square pad
    菱形盤：diamond pad
    長方形焊盤：oblong pad
    子彈形盤：bullet pad
    淚滴盤：teardrop pad
    雪人盤：snowman pad
    V形盤：V-shaped pad
    環(huán)形盤：annular pad
    非圓形盤：non-circular pad
    隔離盤：isolation pad
    非功能連接盤：monfunctional pad
    偏置連接盤：offset land
    腹(背)*盤：back-bard land
    盤址：anchoring spaur
    連接盤圖形：land pattern
    連接盤網(wǎng)格陣列：land grid array
    孔環(huán)：annular ring
    元件孔：component hole
    安裝孔：mounting hole
    支撐孔：supported hole
    導通孔：via
    鍍通孔：plated through hole (PTH)
    余隙孔：access hole
    盲孔：blind via (hole)
    埋孔：buried via hole
    埋/盲孔：buried /blind via
    任意層內(nèi)部導通孔：any layer inner via hole (ALIVH)
    全部鉆孔：all drilled hole
    定位孔：toaling hole
    無連接盤孔：landless hole
    中間孔：interstitial hole
    無連接盤導通孔：landless via hole
    引導孔：pilot hole
    端接全隙孔：terminal clearomee hole
    準表面間鍍覆孔：quasi-interfacing plated-through hole
    準尺寸孔：dimensioned hole
    在連接盤中導通孔：via-in-pad
    孔位：hole location
    孔密度：hole density
    孔圖：hole pattern
    鉆孔圖：drill drawing
    裝配圖：assembly drawing
    印制板組裝圖：printed board assembly drawing
    參考基準：datum referan